Traditional bondtesting is being pushed to the limit by the reduction in wire bonding geometries and the development of stacked die configurations.

At pitches of less than 35 micron, a new generation of bondtester is required. The DAGE 5000 has been specifically designed to meet this challenge by addressing such issues as:

• Lower range force measurement.
• New load tool designs optimised to the changing shape of small geometry bonds and to overcome problems associated with the passivation layer thickness.
• Soft landing and oscillating load tool for stacked die bondtesting.
• Improved optics and illumination facilitatiing load tool alighnment and the grading of failure modes.
• Improved shear height accuracy and repeatability.
• Anti-vibration measures to maintain accuracy and optical performance within typical environmental conditions.
• Improved control over sample manipulation under the test head.

KEY FEATURES

• Low force/high resolution loadcartridgs
• Borescope image system
• Cavity Shear
• 'Quick Guard' load tools
• Built-in anti-vibration mounts
• Soft landing for stacked die applications
• High precision sample manipulation